MC9S08DN32CLC vs MC9S08DN32AMLC Vergleich
Detaillierter Direktvergleich von MC9S08DN32CLC von NXP Semiconductors und MC9S08DN32AMLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DN32CLC | MC9S08DN32AMLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,25 | $3,98 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| CPU Speed | 40 MHz | — |
| Program Memory Size | 32 KB (32K x 8) FLASH | — |
| RAM Size | 1 KB | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Gehäuse | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Terminal Form | GULL WING | — |
| No. of Terminals | 32 | — |
| Package Shape | SQUARE | — |
| Montageart | Surface Mount | Surface Mount |
| Temperature Grade | INDUSTRIAL | — |
| Part Status | Obsolete | — |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| EEPROM | — | Embedded |
| ADC | — | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Betriebstemperatur | — | -40 C to +125 C |
| Versorgungsspannung | — | [DATA_NEEDED: VDD range] |
| Packaging | — | Tray |
| RoHS-Status | — | Compliant |
| Oscillator Type | — | External |
| Debug Interface | — | Background Debug Mode (BDM) |