MC9S08DN32CLC vs MC9S08DN32AMLC Comparación
Comparación detallada lado a lado de MC9S08DN32CLC por NXP Semiconductors y MC9S08DN32AMLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DN32CLC | MC9S08DN32AMLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,25 | $3,98 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-Bit | — |
| CPU Speed | 40 MHz | — |
| Program Memory Size | 32 KB (32K x 8) FLASH | — |
| RAM Size | 1 KB | — |
| EEPROM Size | 1 KB (1K x 8) | — |
| Number of I/O | 25 | 25 |
| Connectivity | I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| Encapsulado | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Terminal Form | GULL WING | — |
| No. of Terminals | 32 | — |
| Package Shape | SQUARE | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperature Grade | INDUSTRIAL | — |
| Part Status | Obsolete | — |
| Core | — | HCS08 (S08) |
| Instruction Set | — | HC08 with BGND |
| CPU Frequency | — | 40 MHz |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| RAM | — | 1.5 KB (1.5K x 8) |
| EEPROM | — | Embedded |
| ADC | — | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Temperatura de funcionamiento | — | -40 C to +125 C |
| Tensión de alimentación | — | [DATA_NEEDED: VDD range] |
| Packaging | — | Tray |
| Estado RoHS | — | Compliant |
| Oscillator Type | — | External |
| Debug Interface | — | Background Debug Mode (BDM) |