MC9S08DN32CLF vs MC9S08DN32CLC Vergleich
Detaillierter Direktvergleich von MC9S08DN32CLF von NXP Semiconductors und MC9S08DN32CLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DN32CLF | MC9S08DN32CLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,55 | $4,25 |
| Core | HCS08 (8-bit) | — |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 32 KB Flash | — |
| RAM | 1.5 KB | — |
| Number of I/O | 39 | 25 |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| CAN | 1x MSCAN (CAN 2.0A/B), 5 message buffers | — |
| USB | USB 2.0 FS device/host/OTG, on-chip transceiver | — |
| Serial Interfaces | 2x SCI (UART), 1x SPI | — |
| Timers | TPM + real-time counter | — |
| Interrupts | Up to 32 interrupt/reset sources | — |
| Versorgungsspannung | 2.7 V to 5.5 V | — |
| Betriebstemperatur | -40 C to +85 C (industrial) | — |
| Gehäuse | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 2 (per JEDEC J-STD-020, 1 year) | — |
| RoHS-Status | Compliant | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |