MC9S08DN32CLF vs MC9S08DN32CLC Comparación
Comparación detallada lado a lado de MC9S08DN32CLF por NXP Semiconductors y MC9S08DN32CLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DN32CLF | MC9S08DN32CLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,55 | $4,25 |
| Core | HCS08 (8-bit) | — |
| Core Frequency | 40 MHz (20 MHz bus) | — |
| Program Memory | 32 KB Flash | — |
| RAM | 1.5 KB | — |
| Number of I/O | 39 | 25 |
| ADC | 16-channel, 12-bit, 2.5 us conversion | — |
| CAN | 1x MSCAN (CAN 2.0A/B), 5 message buffers | — |
| USB | USB 2.0 FS device/host/OTG, on-chip transceiver | — |
| Serial Interfaces | 2x SCI (UART), 1x SPI | — |
| Timers | TPM + real-time counter | — |
| Interrupts | Up to 32 interrupt/reset sources | — |
| Tensión de alimentación | 2.7 V to 5.5 V | — |
| Temperatura de funcionamiento | -40 C to +85 C (industrial) | — |
| Encapsulado | 48-LQFP (7x7 mm) | 32-LQFP (7x7 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 2 (per JEDEC J-STD-020, 1 year) | — |
| Estado RoHS | Compliant | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |