MC9S08DV60ACLH vs MC9S08AW60CFUE Vergleich
Detaillierter Direktvergleich von MC9S08DV60ACLH von NXP Semiconductors und MC9S08AW60CFUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DV60ACLH | MC9S08AW60CFUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $8,10 |
| Product Type | 8-bit microcontroller | 8-bit HCS08 microcontroller |
| Processor Core | S08 core | — |
| Maximum CPU Frequency | 40 MHz | — |
| Flash Memory | 60 KB | — |
| Flash Organization | 60K x 8 bits | — |
| RAM Memory | 3 KB | — |
| Communication Interface | Embedded CAN and LIN master capability | — |
| Gehäuse | 64-LQFP, 10 x 10 mm | 64-QFP, 14 x 14 mm |
| Package Description | QFP 64 | — |
| Montageart | Surface mount | — |
| Instruction Set | HC08 instruction set | HC08 instruction set with added BGND instruction |
| Bus Frequency | 20 MHz | — |
| Interrupt and Reset Sources | Up to 32 sources | — |
| Application | Automotive body electronics and industrial applications | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Pinout | [DATA_NEEDED: complete manufacturer pinout] | — |
| Absolute Maximum Ratings | [DATA_NEEDED: absolute maximum ratings] | — |
| Lebenszyklusstatus | NRND | NRND |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Montagestil | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Supplier Reference | — | NXP USA Inc. |