MC9S08DV60ACLH vs MC9S08AW60CFUE Comparaison
Comparaison détaillée côte à côte de MC9S08DV60ACLH par NXP Semiconductors et MC9S08AW60CFUE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DV60ACLH | MC9S08AW60CFUE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $8,10 |
| Product Type | 8-bit microcontroller | 8-bit HCS08 microcontroller |
| Processor Core | S08 core | — |
| Maximum CPU Frequency | 40 MHz | — |
| Flash Memory | 60 KB | — |
| Flash Organization | 60K x 8 bits | — |
| RAM Memory | 3 KB | — |
| Communication Interface | Embedded CAN and LIN master capability | — |
| Boîtier | 64-LQFP, 10 x 10 mm | 64-QFP, 14 x 14 mm |
| Package Description | QFP 64 | — |
| Type de montage | Surface mount | — |
| Instruction Set | HC08 instruction set | HC08 instruction set with added BGND instruction |
| Bus Frequency | 20 MHz | — |
| Interrupt and Reset Sources | Up to 32 sources | — |
| Application | Automotive body electronics and industrial applications | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Tension d'alimentation | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Statut RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Pinout | [DATA_NEEDED: complete manufacturer pinout] | — |
| Absolute Maximum Ratings | [DATA_NEEDED: absolute maximum ratings] | — |
| Statut du cycle de vie | NRND | NRND |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Style de montage | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Supplier Reference | — | NXP USA Inc. |