MC9S08DV60ACLH vs MC9S08AW60CFUE Comparación
Comparación detallada lado a lado de MC9S08DV60ACLH por NXP Semiconductors y MC9S08AW60CFUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08DV60ACLH | MC9S08AW60CFUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $8,10 |
| Product Type | 8-bit microcontroller | 8-bit HCS08 microcontroller |
| Processor Core | S08 core | — |
| Maximum CPU Frequency | 40 MHz | — |
| Flash Memory | 60 KB | — |
| Flash Organization | 60K x 8 bits | — |
| RAM Memory | 3 KB | — |
| Communication Interface | Embedded CAN and LIN master capability | — |
| Encapsulado | 64-LQFP, 10 x 10 mm | 64-QFP, 14 x 14 mm |
| Package Description | QFP 64 | — |
| Tipo de montaje | Surface mount | — |
| Instruction Set | HC08 instruction set | HC08 instruction set with added BGND instruction |
| Bus Frequency | 20 MHz | — |
| Interrupt and Reset Sources | Up to 32 sources | — |
| Application | Automotive body electronics and industrial applications | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Estado RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Pinout | [DATA_NEEDED: complete manufacturer pinout] | — |
| Absolute Maximum Ratings | [DATA_NEEDED: absolute maximum ratings] | — |
| Estado del ciclo de vida | NRND | NRND |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| RAM | — | 4 KB |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Estilo de montaje | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Debug Interface | — | Single-wire background debug mode interface |
| Application Support | — | Industrial and automotive |
| Supplier Reference | — | NXP USA Inc. |