MC9S08DZ32AMLH vs MC9S08AW32CPUE Vergleich
Detaillierter Direktvergleich von MC9S08DZ32AMLH von NXP Semiconductors und MC9S08AW32CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08DZ32AMLH | MC9S08AW32CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $6,10 |
| Core Processor | HCS08 (S08 core) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Instruction Set | HC08 with added BGND instruction (CISC) | HC08 with added BGND instruction |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| Versorgungsspannung | 3.3V / 5V | — |
| ADC Resolution | 12 bit | 10-bit |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | Single-wire background debug mode (BDM) |
| Gehäuse | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Max Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Betriebstemperatur | — | -40C to +85C |
| Family | — | S08AW (AW60/48/32/16) |