MC9S08DZ32AMLH vs MC9S08AW32CPUE Comparação
Comparação detalhada lado a lado de MC9S08DZ32AMLH por NXP Semiconductors e MC9S08AW32CPUE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
Comparação de especificações
| Parâmetro | MC9S08DZ32AMLH | MC9S08AW32CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | NRND | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $0,00 | $6,10 |
| Core Processor | HCS08 (S08 core) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Instruction Set | HC08 with added BGND instruction (CISC) | HC08 with added BGND instruction |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| Tensão de alimentação | 3.3V / 5V | — |
| ADC Resolution | 12 bit | 10-bit |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | Single-wire background debug mode (BDM) |
| Encapsulamento | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Tipo de montagem | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Status do ciclo de vida | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Max Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Temperatura de operação | — | -40C to +85C |
| Family | — | S08AW (AW60/48/32/16) |