MC9S08DZ32AMLH vs MC9S08AW32CPUE Comparaison
Comparaison détaillée côte à côte de MC9S08DZ32AMLH par NXP Semiconductors et MC9S08AW32CPUE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08DZ32AMLH | MC9S08AW32CPUE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $6,10 |
| Core Processor | HCS08 (S08 core) | S08 |
| Core Size | 8-Bit | 8-Bit |
| Instruction Set | HC08 with added BGND instruction (CISC) | HC08 with added BGND instruction |
| Maximum CPU Frequency | 40 MHz | — |
| Bus Frequency | 20 MHz | — |
| Program Memory Size | 32KB (32K x 8) FLASH | — |
| Tension d'alimentation | 3.3V / 5V | — |
| ADC Resolution | 12 bit | 10-bit |
| ADC Channels | 24-channel | — |
| ADC Conversion Time | 2.5 us | — |
| CAN Module | Yes (embedded CAN, MSCAN) | — |
| EEPROM | Embedded EEPROM | — |
| Interrupt/Reset Sources | Up to 32 | — |
| Debug Interface | On-chip emulation/debug (background debug, BGND) | Single-wire background debug mode (BDM) |
| Boîtier | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | Tray |
| Series | S08DZ (S08 Family, S08D Series) | — |
| Product Category | Microcontrollers (MCU) | — |
| Statut du cycle de vie | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| Max Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32KB (32K x 8) |
| RAM | — | 2KB |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| I/O Count | — | 38 |
| Température de fonctionnement | — | -40C to +85C |
| Family | — | S08AW (AW60/48/32/16) |