MC9S08GT32ACBE vs MC9S08DN32ACLC Vergleich
Detaillierter Direktvergleich von MC9S08GT32ACBE von NXP Semiconductors und MC9S08DN32ACLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteSpezifikationsvergleich
| Parameter | MC9S08GT32ACBE | MC9S08DN32ACLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,10 | $4,35 |
| Core | S08 (enhanced 8-bit HC08-compatible) | — |
| Program Memory (Flash) | 32 KB | — |
| RAM | 4 KB | — |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Gehäuse | 42-pin PDIP (Plastic DIP) | 32-LQFP (7x7 mm) |
| Pin-Anzahl | 42 | — |
| I/O Pins | [DATA_NEEDED: number of GPIO] | — |
| ADC | Multi-channel 10-bit ADC | — |
| Timers | TPM (Timer/PWM Module) | — |
| Serial Interfaces | SCI (UART), SPI, IIC | — |
| Betriebstemperatur | -40C to +85C (industrial) | -40C to +85C |
| Montageart | Through-Hole (PDIP) | Surface Mount |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Series | — | S08DN |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 32 KB (32K x 8) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 1 KB (1K x 8) |
| RAM Size | — | 2 KB |
| Number of I/O | — | 25 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of Interrupt Sources | — | Up to 32 |
| Instruction Set | — | HC08 with added BGND |
| Versorgungsspannung | — | 2.7 V to 5.5 V |
| Part Status | — | Obsolete |