MC9S08GT32ACBE vs MC9S08DN32ACLC Comparação
Comparação detalhada lado a lado de MC9S08GT32ACBE por NXP Semiconductors e MC9S08DN32ACLC por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08DN32ACLC - 8-Bit 40MHz HCS08 MCU 32KB Flash | NXP LQFP-32
MC9S08DN32ACLC ObsoleteComparação de especificações
| Parâmetro | MC9S08GT32ACBE | MC9S08DN32ACLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | Obsolete |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $4,10 | $4,35 |
| Core | S08 (enhanced 8-bit HC08-compatible) | — |
| Program Memory (Flash) | 32 KB | — |
| RAM | 4 KB | — |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 2.7 V to 5.5 V | — |
| Encapsulamento | 42-pin PDIP (Plastic DIP) | 32-LQFP (7x7 mm) |
| Contagem de pinos | 42 | — |
| I/O Pins | [DATA_NEEDED: number of GPIO] | — |
| ADC | Multi-channel 10-bit ADC | — |
| Timers | TPM (Timer/PWM Module) | — |
| Serial Interfaces | SCI (UART), SPI, IIC | — |
| Temperatura de operação | -40C to +85C (industrial) | -40C to +85C |
| Tipo de montagem | Through-Hole (PDIP) | Surface Mount |
| Nível MSL | [DATA_NEEDED: MSL level] | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | — |
| Series | — | S08DN |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz (20 MHz bus) |
| Program Memory Size | — | 32 KB (32K x 8) |
| Program Memory Type | — | FLASH |
| EEPROM Size | — | 1 KB (1K x 8) |
| RAM Size | — | 2 KB |
| Number of I/O | — | 25 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of Interrupt Sources | — | Up to 32 |
| Instruction Set | — | HC08 with added BGND |
| Tensão de alimentação | — | 2.7 V to 5.5 V |
| Part Status | — | Obsolete |