MC9S08LH36CLK vs G9S12GN32F1VLCR Vergleich
Detaillierter Direktvergleich von MC9S08LH36CLK von NXP Semiconductors und G9S12GN32F1VLCR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP
G9S12GN32F1VLCR ✓ AktivSpezifikationsvergleich
| Parameter | MC9S08LH36CLK | G9S12GN32F1VLCR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $3,61 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Gehäuse | 80-LQFP (14 x 14 mm) | LQFP-32 |
| Montageart | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| RoHS-Status | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core | — | S12 (HCS12, 16-bit CISC) |
| Program Flash | — | 32 KB |
| SRAM | — | 2 KB |
| Bus Frequency (max) | — | 25 MHz |
| CAN Controller | — | 1 x CAN 2.0A/B |
| LIN / SAE J2602 | — | Yes (via SCI + external transceiver) |
| ADC | — | 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] |
| PWM Channels | — | Multi-channel 16-bit [DATA_NEEDED: exact channel count] |
| Enhanced Capture Timer (ECT) | — | Yes |
| Betriebstemperatur | — | -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260 °C |
| Maximum Time at Peak Reflow | — | 40 s |
| Terminal Finish | — | Tin (Sn), matte |
| JEDEC J-STD-609 Code | — | e3 |
| Lead-Free | — | Yes (e3 Sn finish) |
| Security | — | Flash security lockout supported [DATA_NEEDED: full feature list] |
| Debug Interface | — | BDM (Background Debug Mode) |