MC9S08LH36CLK vs G9S12GN32F1VLCR Comparação

Comparação detalhada lado a lado de MC9S08LH36CLK por NXP Semiconductors e G9S12GN32F1VLCR por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S08LH36CLK MC9S08LH36CLK - 8-bit S08 MCU 40MHz 36KB Flash | NXP

MC9S08LH36CLK - 8-bit S08 MCU 40MHz 36KB Flash | NXP

MC9S08LH36CLK ✓ Ativo
NXP Semiconductors
G9S12GN32F1VLCR G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP

G9S12GN32F1VLCR ✓ Ativo

Comparação de especificações

Parâmetro MC9S08LH36CLK G9S12GN32F1VLCR
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $3,61
Core Processor S08 —
Core Size 8-Bit —
CPU Frequency 40 MHz —
Bus Frequency (per distributor listing) 16 MHz —
Flash Memory 36 KB (36K x 8) —
Supply Voltage Range 2.1 V to 3.6 V —
Number of I/O 37 —
Encapsulamento 80-LQFP (14 x 14 mm) LQFP-32
Tipo de montagem Surface Mount Surface Mount
Program Memory Type FLASH —
Operating Voltage at Reduced Speed 2.1 V (up to 20 MHz, per family datasheet) —
Lifecycle Stage ACTIVE (per parametric source) —
Status RoHS RoHS Compliant Compliant
Temperature Range [DATA_NEEDED: operating temperature range] —
RAM Size [DATA_NEEDED: RAM size] —
Peripherals [DATA_NEEDED: peripheral set detail] —
Package Body Dimensions 14 mm x 14 mm —
Core — S12 (HCS12, 16-bit CISC)
Program Flash — 32 KB
SRAM — 2 KB
Bus Frequency (max) — 25 MHz
CAN Controller — 1 x CAN 2.0A/B
LIN / SAE J2602 — Yes (via SCI + external transceiver)
ADC — 10-bit, 8 channels [DATA_NEEDED: channel count confirmation]
PWM Channels — Multi-channel 16-bit [DATA_NEEDED: exact channel count]
Enhanced Capture Timer (ECT) — Yes
Temperatura de operação — -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter]
Nível de sensibilidade à umidade (MSL) — 3
Peak Reflow Temperature — 260 °C
Maximum Time at Peak Reflow — 40 s
Terminal Finish — Tin (Sn), matte
JEDEC J-STD-609 Code — e3
Lead-Free — Yes (e3 Sn finish)
Security — Flash security lockout supported [DATA_NEEDED: full feature list]
Debug Interface — BDM (Background Debug Mode)

Fichas técnicas e recursos

Ver todos os produtos Criar BOM Solicitar cotação