MC9S08LH36CLK vs G9S12GN32F1VLCR Сравнение
Подробное сравнение бок о бок MC9S08LH36CLK от NXP Semiconductors и G9S12GN32F1VLCR от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
G9S12GN32F1VLCR - 16-bit S12G MCU, 32KB Flash, CAN/LIN | NXP
G9S12GN32F1VLCR ✓ АктивенСравнение характеристик
| Параметр | MC9S08LH36CLK | G9S12GN32F1VLCR |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $0,00 | $3,61 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | — |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Корпус | 80-LQFP (14 x 14 mm) | LQFP-32 |
| Тип монтажа | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| Статус RoHS | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core | — | S12 (HCS12, 16-bit CISC) |
| Program Flash | — | 32 KB |
| SRAM | — | 2 KB |
| Bus Frequency (max) | — | 25 MHz |
| CAN Controller | — | 1 x CAN 2.0A/B |
| LIN / SAE J2602 | — | Yes (via SCI + external transceiver) |
| ADC | — | 10-bit, 8 channels [DATA_NEEDED: channel count confirmation] |
| PWM Channels | — | Multi-channel 16-bit [DATA_NEEDED: exact channel count] |
| Enhanced Capture Timer (ECT) | — | Yes |
| Рабочая температура | — | -40 C to +105 C (VLC suffix, automotive grade) [DATA_NEEDED: confirmation of grade letter] |
| Уровень чувствительности к влаге (MSL) | — | 3 |
| Peak Reflow Temperature | — | 260 °C |
| Maximum Time at Peak Reflow | — | 40 s |
| Terminal Finish | — | Tin (Sn), matte |
| JEDEC J-STD-609 Code | — | e3 |
| Lead-Free | — | Yes (e3 Sn finish) |
| Security | — | Flash security lockout supported [DATA_NEEDED: full feature list] |
| Debug Interface | — | BDM (Background Debug Mode) |