MC9S08LH36CLK vs S9S12GN16F1VLC Vergleich
Detaillierter Direktvergleich von MC9S08LH36CLK von NXP Semiconductors und S9S12GN16F1VLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08LH36CLK | S9S12GN16F1VLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $2,13 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | 25 MHz |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Gehäuse | 80-LQFP (14 x 14 mm) | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| RoHS-Status | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 16 KB |
| RAM | — | 2 KB |
| Operating Voltage | — | 3.3 V / 5 V |
| Betriebstemperaturbereich | — | -40 C to +105 C |
| Communication Interfaces | — | CAN, LIN/SAE J2602, SCI, SPI, I2C |
| ADC | — | 10-bit |
| Timer Module | — | 8-channel TIM (PWM/capture/compare) |
| Automotive Qualification | — | AEC-Q100 |
| Debug Interface | — | BDM (Background Debug Mode) |
| Flash ECC | — | Yes |