MC9S08LH36CLK vs S9S12GN16F1VLC Comparaison
Comparaison détaillée côte à côte de MC9S08LH36CLK par NXP Semiconductors et S9S12GN16F1VLC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08LH36CLK | S9S12GN16F1VLC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $2,13 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | 25 MHz |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Boîtier | 80-LQFP (14 x 14 mm) | 32-LQFP (7x7 mm) |
| Type de montage | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| Statut RoHS | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 16 KB |
| RAM | — | 2 KB |
| Operating Voltage | — | 3.3 V / 5 V |
| Plage de température de fonctionnement | — | -40 C to +105 C |
| Communication Interfaces | — | CAN, LIN/SAE J2602, SCI, SPI, I2C |
| ADC | — | 10-bit |
| Timer Module | — | 8-channel TIM (PWM/capture/compare) |
| Automotive Qualification | — | AEC-Q100 |
| Debug Interface | — | BDM (Background Debug Mode) |
| Flash ECC | — | Yes |