MC9S08LH36CLK vs S9S12GN16F1VLC Comparación
Comparación detallada lado a lado de MC9S08LH36CLK por NXP Semiconductors y S9S12GN16F1VLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08LH36CLK | S9S12GN16F1VLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $2,13 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Frequency | 40 MHz | 25 MHz |
| Bus Frequency (per distributor listing) | 16 MHz | — |
| Flash Memory | 36 KB (36K x 8) | — |
| Supply Voltage Range | 2.1 V to 3.6 V | — |
| Number of I/O | 37 | — |
| Encapsulado | 80-LQFP (14 x 14 mm) | 32-LQFP (7x7 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Program Memory Type | FLASH | — |
| Operating Voltage at Reduced Speed | 2.1 V (up to 20 MHz, per family datasheet) | — |
| Lifecycle Stage | ACTIVE (per parametric source) | — |
| Estado RoHS | RoHS Compliant | Compliant |
| Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| Peripherals | [DATA_NEEDED: peripheral set detail] | — |
| Package Body Dimensions | 14 mm x 14 mm | — |
| Core Architecture | — | HCS12 (16-bit CISC) |
| Program Memory (Flash) | — | 16 KB |
| RAM | — | 2 KB |
| Operating Voltage | — | 3.3 V / 5 V |
| Rango de temperatura de funcionamiento | — | -40 C to +105 C |
| Communication Interfaces | — | CAN, LIN/SAE J2602, SCI, SPI, I2C |
| ADC | — | 10-bit |
| Timer Module | — | 8-channel TIM (PWM/capture/compare) |
| Automotive Qualification | — | AEC-Q100 |
| Debug Interface | — | BDM (Background Debug Mode) |
| Flash ECC | — | Yes |