MC9S08QD2CSC vs S9S08QD4J2MSCR Vergleich
Detaillierter Direktvergleich von MC9S08QD2CSC von NXP Semiconductors und S9S08QD4J2MSCR von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)
MC9S08QD2CSC ✓ AktivSpezifikationsvergleich
| Parameter | MC9S08QD2CSC | S9S08QD4J2MSCR |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Instruction Set Architecture | CISC | CISC (68 HC08 with added BGND) |
| Speed (Bus Frequency) | 16 MHz | — |
| Program Memory Type | Flash | Flash |
| Program Memory Size | 2KB (2K x 8) | 4 KB (4K x 8) |
| RAM Size | 128 x 8 | — |
| Number of I/O | 4 | — |
| Versorgungsspannung | 3.3 V / 5 V | 2.7 V to 5.5 V |
| Oscillator Type | Internal | — |
| Gehäuse / Bauform | 8-SOIC (0.154 in, 3.90 mm Width) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tape & Reel | Tape & Reel (TR) |
| Technology | CMOS | — |
| Product Series | S08QD (9S08QD4 SERIES per distributor listing) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Core | — | HCS08 |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Gehäuse | — | 8-SOIC (0.154 inch, 3.90 mm width) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |