MC9S08QD2CSC vs S9S08QD4J2MSCR Comparación
Comparación detallada lado a lado de MC9S08QD2CSC por NXP Semiconductors y S9S08QD4J2MSCR por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)
MC9S08QD2CSC ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08QD2CSC | S9S08QD4J2MSCR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Instruction Set Architecture | CISC | CISC (68 HC08 with added BGND) |
| Speed (Bus Frequency) | 16 MHz | — |
| Program Memory Type | Flash | Flash |
| Program Memory Size | 2KB (2K x 8) | 4 KB (4K x 8) |
| RAM Size | 128 x 8 | — |
| Number of I/O | 4 | — |
| Tensión de alimentación | 3.3 V / 5 V | 2.7 V to 5.5 V |
| Oscillator Type | Internal | — |
| Encapsulado / Carcasa | 8-SOIC (0.154 in, 3.90 mm Width) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tape & Reel | Tape & Reel (TR) |
| Technology | CMOS | — |
| Product Series | S08QD (9S08QD4 SERIES per distributor listing) | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Core | — | HCS08 |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Encapsulado | — | 8-SOIC (0.154 inch, 3.90 mm width) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |