MC9S08QD2CSC vs S9S08QD4J2MSCR Comparaison
Comparaison détaillée côte à côte de MC9S08QD2CSC par NXP Semiconductors et S9S08QD4J2MSCR par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S08QD2CSC - 8-bit MCU 2KB Flash 16MHz SOIC-8 | NXP (Tape & Reel)
MC9S08QD2CSC ✓ ActifComparaison des spécifications
| Paramètre | MC9S08QD2CSC | S9S08QD4J2MSCR |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| Instruction Set Architecture | CISC | CISC (68 HC08 with added BGND) |
| Speed (Bus Frequency) | 16 MHz | — |
| Program Memory Type | Flash | Flash |
| Program Memory Size | 2KB (2K x 8) | 4 KB (4K x 8) |
| RAM Size | 128 x 8 | — |
| Number of I/O | 4 | — |
| Tension d'alimentation | 3.3 V / 5 V | 2.7 V to 5.5 V |
| Oscillator Type | Internal | — |
| Boîtier / Format | 8-SOIC (0.154 in, 3.90 mm Width) | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tape & Reel | Tape & Reel (TR) |
| Technology | CMOS | — |
| Product Series | S08QD (9S08QD4 SERIES per distributor listing) | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Core | — | HCS08 |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Boîtier | — | 8-SOIC (0.154 inch, 3.90 mm width) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |