MC9S08QE32CLCR vs MC9S08DN32CLC Vergleich
Detaillierter Direktvergleich von MC9S08QE32CLCR von NXP Semiconductors und MC9S08DN32CLC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QE32CLCR | MC9S08DN32CLC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,20 | $4,25 |
| Core Architecture | S08 (8-bit CISC, HC08-extended ISA) | — |
| Program Memory (Flash) | 32 KB | — |
| Data Memory (RAM) | 2 KB | — |
| Maximum CPU Frequency | 50.33 MHz | — |
| Versorgungsspannung | 2.5 V / 3.3 V (5 V-tolerant I/O on select pins) | — |
| Gehäuse | 32-pin LQFP (7x7 mm), Tape & Reel | 32-LQFP (7x7 mm) |
| Montageart | Surface Mount | Surface Mount |
| ADC | 12-bit on-chip | — |
| LCD Driver | Integrated segment LCD driver | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Timers | Multiple S08 TPM/MTIM channels | — |
| Debug Interface | Background Debug Mode (BDM), single-wire | — |
| Betriebstemperaturbereich | -40 C to +85 C | — |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant | — |
| Lead-Free / Halogen-Free | Lead-free; halogen-free status unknown | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Number of I/O | — | 25 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |