MC9S08QE32CLCR vs MC9S08DN32CLC Comparación
Comparación detallada lado a lado de MC9S08QE32CLCR por NXP Semiconductors y MC9S08DN32CLC por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QE32CLCR | MC9S08DN32CLC |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,20 | $4,25 |
| Core Architecture | S08 (8-bit CISC, HC08-extended ISA) | — |
| Program Memory (Flash) | 32 KB | — |
| Data Memory (RAM) | 2 KB | — |
| Maximum CPU Frequency | 50.33 MHz | — |
| Tensión de alimentación | 2.5 V / 3.3 V (5 V-tolerant I/O on select pins) | — |
| Encapsulado | 32-pin LQFP (7x7 mm), Tape & Reel | 32-LQFP (7x7 mm) |
| Tipo de montaje | Surface Mount | Surface Mount |
| ADC | 12-bit on-chip | — |
| LCD Driver | Integrated segment LCD driver | — |
| Serial Interfaces | SCI (UART), SPI, I2C | — |
| Timers | Multiple S08 TPM/MTIM channels | — |
| Debug Interface | Background Debug Mode (BDM), single-wire | — |
| Rango de temperatura de funcionamiento | -40 C to +85 C | — |
| Nivel MSL | 3 | — |
| Estado RoHS | Compliant | — |
| Lead-Free / Halogen-Free | Lead-free; halogen-free status unknown | — |
| Core Processor | — | S08 (HCS08) |
| Core Size | — | 8-Bit |
| CPU Speed | — | 40 MHz |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 1 KB |
| EEPROM Size | — | 1 KB (1K x 8) |
| Number of I/O | — | 25 |
| Connectivity | — | I2C, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Terminal Form | — | GULL WING |
| No. of Terminals | — | 32 |
| Package Shape | — | SQUARE |
| Temperature Grade | — | INDUSTRIAL |
| Part Status | — | Obsolete |