MC9S08QG4CFFE vs MC9S08QE4CPG Vergleich
Detaillierter Direktvergleich von MC9S08QG4CFFE von NXP Semiconductors und MC9S08QE4CPG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QG4CFFE | MC9S08QE4CPG |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,10 | $2,05 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Maximale Taktfrequenz | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| Versorgungsspannung | 2.5 V / 3.3 V | — |
| Gehäuse | 16-QFN-EP (5x5 mm), QFN EP | 16-pin PDIP (DIP-16, through-hole) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Montageart | Surface Mount | Through-Hole (PDIP) |
| Packaging | Tray | — |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | S08 (HCS08) 8-bit CPU |
| CPU Maximum Frequency | — | 20 MHz (50.33 MHz bus at VDD >= 2.1 V) |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 512 B |
| Supply Voltage (VDD) | — | 1.8 V to 3.6 V |
| I/O Pins | — | Up to 12 general-purpose I/O (per 16-pin package) |
| ADC | — | Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] |
| Timers | — | Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] |
| Communication | — | SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] |
| Low-Power Stop Mode Current | — | Approx. 1 uA |
| Debug Interface | — | Background Debug Mode (BDM) |
| RoHS-Status | — | Compliant |
| Family | — | S08QE (Flexis, 8/32-bit pin-compatible family) |
| Lifecycle Stage | — | ACTIVE |