MC9S08QG4CFFE vs MC9S08QE4CPG Comparación
Comparación detallada lado a lado de MC9S08QG4CFFE por NXP Semiconductors y MC9S08QE4CPG por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QG4CFFE | MC9S08QE4CPG |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1,10 | $2,05 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Frecuencia de reloj máxima | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| Tensión de alimentación | 2.5 V / 3.3 V | — |
| Encapsulado | 16-QFN-EP (5x5 mm), QFN EP | 16-pin PDIP (DIP-16, through-hole) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Tipo de montaje | Surface Mount | Through-Hole (PDIP) |
| Packaging | Tray | — |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | S08 (HCS08) 8-bit CPU |
| CPU Maximum Frequency | — | 20 MHz (50.33 MHz bus at VDD >= 2.1 V) |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 512 B |
| Supply Voltage (VDD) | — | 1.8 V to 3.6 V |
| I/O Pins | — | Up to 12 general-purpose I/O (per 16-pin package) |
| ADC | — | Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] |
| Timers | — | Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] |
| Communication | — | SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] |
| Low-Power Stop Mode Current | — | Approx. 1 uA |
| Debug Interface | — | Background Debug Mode (BDM) |
| Estado RoHS | — | Compliant |
| Family | — | S08QE (Flexis, 8/32-bit pin-compatible family) |
| Lifecycle Stage | — | ACTIVE |