MC9S08QG4CFFE vs MC9S08QE4CPG Comparaison
Comparaison détaillée côte à côte de MC9S08QG4CFFE par NXP Semiconductors et MC9S08QE4CPG par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QG4CFFE | MC9S08QE4CPG |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,10 | $2,05 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Fréquence d'horloge maximale | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| Tension d'alimentation | 2.5 V / 3.3 V | — |
| Boîtier | 16-QFN-EP (5x5 mm), QFN EP | 16-pin PDIP (DIP-16, through-hole) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Type de montage | Surface Mount | Through-Hole (PDIP) |
| Packaging | Tray | — |
| Statut du cycle de vie | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40C to +85C (industrial) |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | S08 (HCS08) 8-bit CPU |
| CPU Maximum Frequency | — | 20 MHz (50.33 MHz bus at VDD >= 2.1 V) |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| RAM | — | 512 B |
| Supply Voltage (VDD) | — | 1.8 V to 3.6 V |
| I/O Pins | — | Up to 12 general-purpose I/O (per 16-pin package) |
| ADC | — | Integrated multi-channel ADC [DATA_NEEDED: channel count and resolution] |
| Timers | — | Multiple TPM/MTIM channels plus periodic interrupt timer [DATA_NEEDED: exact channel count] |
| Communication | — | SCI/UART, SPI, I2C [DATA_NEEDED: instance count per peripheral] |
| Low-Power Stop Mode Current | — | Approx. 1 uA |
| Debug Interface | — | Background Debug Mode (BDM) |
| Statut RoHS | — | Compliant |
| Family | — | S08QE (Flexis, 8/32-bit pin-compatible family) |
| Lifecycle Stage | — | ACTIVE |