MC9S08QG4CFFE vs S9S08QD2J1MSC Vergleich

Detaillierter Direktvergleich von MC9S08QG4CFFE von NXP Semiconductors und S9S08QD2J1MSC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08QG4CFFE MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP

MC9S08QG4CFFE ✗ Abgekündigt
NXP Semiconductors
S9S08QD2J1MSC S9S08QD2J1MSC - 8-bit S08 MCU, 2KB Flash, 16MHz | NXP

S9S08QD2J1MSC - 8-bit S08 MCU, 2KB Flash, 16MHz | NXP

S9S08QD2J1MSC ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S08QG4CFFE S9S08QD2J1MSC
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Ende des Lebenszyklus Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,10 $0,89
Core Processor S08 —
Core Size 8-Bit —
CPU Architecture HCS08 CISC, HC08 instruction set with added BGND instruction —
Maximale Taktfrequenz 20 MHz —
Program Memory Size 4KB (4K x 8) FLASH —
Versorgungsspannung 2.5 V / 3.3 V —
Gehäuse 16-QFN-EP (5x5 mm), QFN EP 8-pin SOIC (SOIC-8)
Package Code HVQCCN —
Package Shape Square —
Number of Terminals 16 —
Terminal Form No Lead —
Temperature Grade Industrial —
Series S08QG (QG Series, S08 Family) —
Debug Features Background debugging system, single breakpoint in-circuit plus two more on-chip —
Montageart Surface Mount Surface Mount
Packaging Tray —
Lebenszyklusstatus End of Life (per NXP product page) —
Program RAM Size [DATA_NEEDED: Program RAM size] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
Number of I/O [DATA_NEEDED: number of GPIO] —
Betriebstemperaturbereich [DATA_NEEDED: operating temperature range] —
Data Converters [DATA_NEEDED: on-chip data converter summary] —
Core — HCS08 (S08) 8-bit CISC
Program Memory (Flash) — 2 KB (2K x 8)
RAM Size — 128 bytes
Maximum CPU Frequency — 16 MHz
Supply Voltage (Vcc/Vdd) — 2.7 V to 5.5 V
Betriebstemperatur — -40C to +125C (Automotive Grade)
Number of I/O Pins — 4
Peripherals — LVD, POR, PWM, WDT
Connectivity — -
Debug Interface — Single-wire Background Debug Mode (BDM)
EEPROM — None (Flash-based)
MSL-Level — [DATA_NEEDED: MSL rating]
RoHS-Status — Compliant
AEC-Q100 — Qualified (Automotive)

Datenblätter & Ressourcen

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