MC9S08QG4CFFE vs S9S08QD2J1MSC Comparaison
Comparaison détaillée côte à côte de MC9S08QG4CFFE par NXP Semiconductors et S9S08QD2J1MSC par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QG4CFFE | S9S08QD2J1MSC |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,10 | $0,89 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| Fréquence d'horloge maximale | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| Tension d'alimentation | 2.5 V / 3.3 V | — |
| Boîtier | 16-QFN-EP (5x5 mm), QFN EP | 8-pin SOIC (SOIC-8) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| Type de montage | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Statut du cycle de vie | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| Plage de température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | HCS08 (S08) 8-bit CISC |
| Program Memory (Flash) | — | 2 KB (2K x 8) |
| RAM Size | — | 128 bytes |
| Maximum CPU Frequency | — | 16 MHz |
| Supply Voltage (Vcc/Vdd) | — | 2.7 V to 5.5 V |
| Température de fonctionnement | — | -40C to +125C (Automotive Grade) |
| Number of I/O Pins | — | 4 |
| Peripherals | — | LVD, POR, PWM, WDT |
| Connectivity | — | - |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |
| EEPROM | — | None (Flash-based) |
| Niveau MSL | — | [DATA_NEEDED: MSL rating] |
| Statut RoHS | — | Compliant |
| AEC-Q100 | — | Qualified (Automotive) |