MC9S08QG4CFFE vs S9S08QD2J1MSC 对比
详细并排对比 MC9S08QG4CFFE 出自 NXP Semiconductors 和 S9S08QD2J1MSC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08QG4CFFE | S9S08QD2J1MSC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $1.10 | $0.89 |
| Core Processor | S08 | — |
| Core Size | 8-Bit | — |
| CPU Architecture | HCS08 CISC, HC08 instruction set with added BGND instruction | — |
| 最大时钟频率 | 20 MHz | — |
| Program Memory Size | 4KB (4K x 8) FLASH | — |
| 电源电压 | 2.5 V / 3.3 V | — |
| 封装 | 16-QFN-EP (5x5 mm), QFN EP | 8-pin SOIC (SOIC-8) |
| Package Code | HVQCCN | — |
| Package Shape | Square | — |
| Number of Terminals | 16 | — |
| Terminal Form | No Lead | — |
| Temperature Grade | Industrial | — |
| Series | S08QG (QG Series, S08 Family) | — |
| Debug Features | Background debugging system, single breakpoint in-circuit plus two more on-chip | — |
| 安装类型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| 生命周期状态 | End of Life (per NXP product page) | — |
| Program RAM Size | [DATA_NEEDED: Program RAM size] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Number of I/O | [DATA_NEEDED: number of GPIO] | — |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| Data Converters | [DATA_NEEDED: on-chip data converter summary] | — |
| Core | — | HCS08 (S08) 8-bit CISC |
| Program Memory (Flash) | — | 2 KB (2K x 8) |
| RAM Size | — | 128 bytes |
| Maximum CPU Frequency | — | 16 MHz |
| Supply Voltage (Vcc/Vdd) | — | 2.7 V to 5.5 V |
| 工作温度 | — | -40C to +125C (Automotive Grade) |
| Number of I/O Pins | — | 4 |
| Peripherals | — | LVD, POR, PWM, WDT |
| Connectivity | — | - |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |
| EEPROM | — | None (Flash-based) |
| MSL 等级 | — | [DATA_NEEDED: MSL rating] |
| RoHS 状态 | — | Compliant |
| AEC-Q100 | — | Qualified (Automotive) |