MC9S08QG84CFFE vs MC9S08QG4CFFE Vergleich
Detaillierter Direktvergleich von MC9S08QG84CFFE von NXP Semiconductors und MC9S08QG4CFFE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08QG84CFFE | MC9S08QG4CFFE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,21 | $1,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 |
| Core Size | 8-bit | 8-Bit |
| Speed | 20 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| Versorgungsspannung | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Gehäuse | 16-QFN-EP (5x5 mm), Exposed Pad | 16-QFN-EP (5x5 mm), QFN EP |
| Montageart | Surface Mount | Surface Mount |
| Architecture | S08 | — |
| Instruction Set | CISC | — |
| Peripherals | ADC, POR, PWM, WDT | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O | [DATA_NEEDED: number of I/O] | [DATA_NEEDED: number of GPIO] |
| Data Converters | A/D 8x10-bit | [DATA_NEEDED: on-chip data converter summary] |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RoHS-Status | RoHS3 (per Mouser ROO listing) | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Pin Pitch | 0.5 mm (QFN-16 class) | — |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Maximale Taktfrequenz | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Lebenszyklusstatus | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |