MC9S08QG84CFFE vs MC9S08QG4CFFE Сравнение
Подробное сравнение бок о бок MC9S08QG84CFFE от NXP Semiconductors и MC9S08QG4CFFE от NXP Semiconductors. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
NXP Semiconductors
MC9S08QG4CFFE - S08 8-bit MCU 4KB Flash 20MHz | NXP
MC9S08QG4CFFE ✗ Снят с производстваСравнение характеристик
| Параметр | MC9S08QG84CFFE | MC9S08QG4CFFE |
|---|---|---|
| Бренд | NXP Semiconductors | NXP Semiconductors |
| Категория | Microcontrollers | Microcontrollers |
| Статус жизненного цикла | Активен | Снято с производства |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1,21 | $1,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 |
| Core Size | 8-bit | 8-Bit |
| Speed | 20 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| Напряжение питания | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Корпус | 16-QFN-EP (5x5 mm), Exposed Pad | 16-QFN-EP (5x5 mm), QFN EP |
| Тип монтажа | Surface Mount | Surface Mount |
| Architecture | S08 | — |
| Instruction Set | CISC | — |
| Peripherals | ADC, POR, PWM, WDT | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O | [DATA_NEEDED: number of I/O] | [DATA_NEEDED: number of GPIO] |
| Data Converters | A/D 8x10-bit | [DATA_NEEDED: on-chip data converter summary] |
| Рабочая температура | [DATA_NEEDED: operating temperature range] | — |
| Статус RoHS | RoHS3 (per Mouser ROO listing) | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Pin Pitch | 0.5 mm (QFN-16 class) | — |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Максимальная тактовая частота | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Статус жизненного цикла | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Диапазон рабочих температур | — | [DATA_NEEDED: operating temperature range] |