MC9S08QG84CFFE vs MC9S08QG4CFFE Comparaison
Comparaison détaillée côte à côte de MC9S08QG84CFFE par NXP Semiconductors et MC9S08QG4CFFE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QG84CFFE | MC9S08QG4CFFE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $1,21 | $1,10 |
| Core Processor | S08 (HCS08) 8-bit CISC | S08 |
| Core Size | 8-bit | 8-Bit |
| Speed | 20 MHz | — |
| Flash Memory | 8 KB (8K x 8) | — |
| Tension d'alimentation | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Boîtier | 16-QFN-EP (5x5 mm), Exposed Pad | 16-QFN-EP (5x5 mm), QFN EP |
| Type de montage | Surface Mount | Surface Mount |
| Architecture | S08 | — |
| Instruction Set | CISC | — |
| Peripherals | ADC, POR, PWM, WDT | — |
| RAM Size | [DATA_NEEDED: RAM size] | — |
| EEPROM Size | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O | [DATA_NEEDED: number of I/O] | [DATA_NEEDED: number of GPIO] |
| Data Converters | A/D 8x10-bit | [DATA_NEEDED: on-chip data converter summary] |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Statut RoHS | RoHS3 (per Mouser ROO listing) | — |
| Moisture Sensitivity | [DATA_NEEDED: MSL level] | — |
| Pin Pitch | 0.5 mm (QFN-16 class) | — |
| CPU Architecture | — | HCS08 CISC, HC08 instruction set with added BGND instruction |
| Fréquence d'horloge maximale | — | 20 MHz |
| Program Memory Size | — | 4KB (4K x 8) FLASH |
| Package Code | — | HVQCCN |
| Package Shape | — | Square |
| Number of Terminals | — | 16 |
| Terminal Form | — | No Lead |
| Temperature Grade | — | Industrial |
| Series | — | S08QG (QG Series, S08 Family) |
| Debug Features | — | Background debugging system, single breakpoint in-circuit plus two more on-chip |
| Packaging | — | Tray |
| Statut du cycle de vie | — | End of Life (per NXP product page) |
| Program RAM Size | — | [DATA_NEEDED: Program RAM size] |
| ADC Resolution | — | [DATA_NEEDED: ADC resolution and channels] |
| Plage de température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |