MC9S08SH4CTG vs MC9S08SH4CTJ Vergleich

Detaillierter Direktvergleich von MC9S08SH4CTG von NXP Semiconductors und MC9S08SH4CTJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08SH4CTJ MC9S08SH4CTJ - 8-bit 40MHz HCS08 MCU 4KB Flash 20-TSSOP

MC9S08SH4CTJ - 8-bit 40MHz HCS08 MCU 4KB Flash 20-TSSOP

MC9S08SH4CTJ Nrnd

Spezifikationsvergleich

Parameter MC9S08SH4CTG MC9S08SH4CTJ
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $2,05 $1,85
Core S08 (HCS08) 8-bit CISC —
CPU Speed 40 MHz (20 MHz bus) —
Program Memory 4 KB flash —
RAM 256 B 256 B
Gehäuse 16-pin TSSOP 20-pin TSSOP
Operating Voltage 2.7 V to 5.5 V 2.7 V to 5.5 V
ADC 12-channel, 10-bit, 2.5 µs conversion 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor
Analog Comparator Yes Yes (integrated)
Temperature Sensor Internal —
Communication Interfaces SCI, SPI, I²C SCI/UART, SPI, I2C
GPIO 13 —
Interrupt Sources Up to 32 Up to 32
Betriebstemperatur -40 °C to +85 °C -40 C to +85 C (industrial, TJ suffix implied)
Montageart Surface Mount Surface Mount
MSL-Level 1 —
Background Debug Yes (single-wire BGND) —
RoHS-Status [DATA_NEEDED: rohs status] Compliant
Core Architecture — HCS08 (enhanced 8-bit)
CPU Bit Width — 8-bit
Maximum Bus Frequency — 40 MHz
Program Memory (Flash) — 4 KB (4K x 8)
Timers — MTIM, RTI, TPM (PWM)
Low-Power Modes — STOP, WAIT with fast wake-up
Debug Interface — Single-wire BDM (background debug mode)
Instruction Set — HC08 with BGND extension

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