MC9S08SH4CTG vs MC9S08SH4CTJ Comparaison
Comparaison détaillée côte à côte de MC9S08SH4CTG par NXP Semiconductors et MC9S08SH4CTJ par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08SH4CTG | MC9S08SH4CTJ |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | NRND | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $2,05 | $1,85 |
| Core | S08 (HCS08) 8-bit CISC | — |
| CPU Speed | 40 MHz (20 MHz bus) | — |
| Program Memory | 4 KB flash | — |
| RAM | 256 B | 256 B |
| Boîtier | 16-pin TSSOP | 20-pin TSSOP |
| Operating Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC | 12-channel, 10-bit, 2.5 µs conversion | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor |
| Analog Comparator | Yes | Yes (integrated) |
| Temperature Sensor | Internal | — |
| Communication Interfaces | SCI, SPI, I²C | SCI/UART, SPI, I2C |
| GPIO | 13 | — |
| Interrupt Sources | Up to 32 | Up to 32 |
| Température de fonctionnement | -40 °C to +85 °C | -40 C to +85 C (industrial, TJ suffix implied) |
| Type de montage | Surface Mount | Surface Mount |
| Niveau MSL | 1 | — |
| Background Debug | Yes (single-wire BGND) | — |
| Statut RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Core Architecture | — | HCS08 (enhanced 8-bit) |
| CPU Bit Width | — | 8-bit |
| Maximum Bus Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| Timers | — | MTIM, RTI, TPM (PWM) |
| Low-Power Modes | — | STOP, WAIT with fast wake-up |
| Debug Interface | — | Single-wire BDM (background debug mode) |
| Instruction Set | — | HC08 with BGND extension |