MC9S08SH4CTG vs MC9S08SH4CTJ Comparación
Comparación detallada lado a lado de MC9S08SH4CTG por NXP Semiconductors y MC9S08SH4CTJ por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08SH4CTG | MC9S08SH4CTJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,05 | $1,85 |
| Core | S08 (HCS08) 8-bit CISC | — |
| CPU Speed | 40 MHz (20 MHz bus) | — |
| Program Memory | 4 KB flash | — |
| RAM | 256 B | 256 B |
| Encapsulado | 16-pin TSSOP | 20-pin TSSOP |
| Operating Voltage | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| ADC | 12-channel, 10-bit, 2.5 µs conversion | 12-channel, 10-bit, 2.5 us conversion, auto-compare, internal temperature sensor |
| Analog Comparator | Yes | Yes (integrated) |
| Temperature Sensor | Internal | — |
| Communication Interfaces | SCI, SPI, I²C | SCI/UART, SPI, I2C |
| GPIO | 13 | — |
| Interrupt Sources | Up to 32 | Up to 32 |
| Temperatura de funcionamiento | -40 °C to +85 °C | -40 C to +85 C (industrial, TJ suffix implied) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 1 | — |
| Background Debug | Yes (single-wire BGND) | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Core Architecture | — | HCS08 (enhanced 8-bit) |
| CPU Bit Width | — | 8-bit |
| Maximum Bus Frequency | — | 40 MHz |
| Program Memory (Flash) | — | 4 KB (4K x 8) |
| Timers | — | MTIM, RTI, TPM (PWM) |
| Low-Power Modes | — | STOP, WAIT with fast wake-up |
| Debug Interface | — | Single-wire BDM (background debug mode) |
| Instruction Set | — | HC08 with BGND extension |