MC9S08SV8CBM vs MC9S08AW32CFGE Vergleich

Detaillierter Direktvergleich von MC9S08SV8CBM von NXP Semiconductors und MC9S08AW32CFGE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08SV8CBM MC9S08SV8CBM - 8-bit S08 MCU, 8KB Flash, 40MHz, 32-SDIP | NXP

MC9S08SV8CBM - 8-bit S08 MCU, 8KB Flash, 40MHz, 32-SDIP | NXP

MC9S08SV8CBM ✓ Aktiv
NXP Semiconductors
MC9S08AW32CFGE MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE - 8-bit S08 MCU 32KB Flash 40MHz | NXP

MC9S08AW32CFGE Nrnd

Spezifikationsvergleich

Parameter MC9S08SV8CBM MC9S08AW32CFGE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1,65 $2,86
Product Type 8-bit Microcontroller (MCU) —
Core HCS08 (HC08 instruction set) —
Program Memory (Flash) 8 KB (8K x 8) —
RAM Size 768 x 8 (768 bytes) —
CPU Speed 40 MHz (max bus clock) —
Number of I/O 30 —
Gehäuse / Bauform 32-SDIP (0.400", 10.16 mm) —
Montageart Through-Hole (DIP) Surface Mount
Oscillator Type Internal —
Betriebsversorgungsspannung 2.7 V to 5.5 V —
Betriebstemperaturbereich -40C to +85C —
Data Converters [DATA_NEEDED: ADC channels and resolution] —
Connectivity [DATA_NEEDED: SCI/SPI/I2C instance count] —
Peripherals [DATA_NEEDED: timers, watchdog, LVD list] —
Packaging Tube —
MSL-Level [DATA_NEEDED: moisture sensitivity level] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Core Processor — S08 (HCS08) 8-bit CISC
Core Size — 8-bit
Maximum CPU Frequency — 40 MHz
Internal Bus Frequency — 20 MHz
Flash Memory — 32 KB (32K x 8)
RAM — 2 KB
EEPROM — [DATA_NEEDED: EEPROM size]
Supply Voltage Range — 2.7 V to 5.5 V
ADC Resolution — 10-bit
ADC Channels — 8-channel
General Purpose I/O — 34
Gehäuse — 44-LQFP (10x10 mm), 0.5 mm pitch
Package Standard — MO-220VKKD-2, 7 x 7 mm body variants per distributor listing
Debug Interface — Single-wire background debug mode (BDM)
Instruction Set — HC08 instruction set with added BGND instruction
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Lebenszyklusstatus — NRND (Not Recommended for New Designs)

Datenblätter & Ressourcen

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