MC9S08SV8CBM vs MC9S08AW32CFGE Comparação
Comparação detalhada lado a lado de MC9S08SV8CBM por NXP Semiconductors e MC9S08AW32CFGE por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9S08SV8CBM - 8-bit S08 MCU, 8KB Flash, 40MHz, 32-SDIP | NXP
MC9S08SV8CBM ✓ Ativo
Comparação de especificações
| Parâmetro | MC9S08SV8CBM | MC9S08AW32CFGE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Ativo | NRND |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $1,65 | $2,86 |
| Product Type | 8-bit Microcontroller (MCU) | — |
| Core | HCS08 (HC08 instruction set) | — |
| Program Memory (Flash) | 8 KB (8K x 8) | — |
| RAM Size | 768 x 8 (768 bytes) | — |
| CPU Speed | 40 MHz (max bus clock) | — |
| Number of I/O | 30 | — |
| Encapsulamento / Caixa | 32-SDIP (0.400", 10.16 mm) | — |
| Tipo de montagem | Through-Hole (DIP) | Surface Mount |
| Oscillator Type | Internal | — |
| Tensão de alimentação de operação | 2.7 V to 5.5 V | — |
| Faixa de temperatura de operação | -40C to +85C | — |
| Data Converters | [DATA_NEEDED: ADC channels and resolution] | — |
| Connectivity | [DATA_NEEDED: SCI/SPI/I2C instance count] | — |
| Peripherals | [DATA_NEEDED: timers, watchdog, LVD list] | — |
| Packaging | Tube | — |
| Nível MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Status RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Core Processor | — | S08 (HCS08) 8-bit CISC |
| Core Size | — | 8-bit |
| Maximum CPU Frequency | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Flash Memory | — | 32 KB (32K x 8) |
| RAM | — | 2 KB |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Supply Voltage Range | — | 2.7 V to 5.5 V |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 8-channel |
| General Purpose I/O | — | 34 |
| Encapsulamento | — | 44-LQFP (10x10 mm), 0.5 mm pitch |
| Package Standard | — | MO-220VKKD-2, 7 x 7 mm body variants per distributor listing |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Temperatura de operação | — | [DATA_NEEDED: operating temperature range] |
| Status do ciclo de vida | — | NRND (Not Recommended for New Designs) |