MC9S12DG128CPVE vs MC9S12UF32PB Vergleich

Detaillierter Direktvergleich von MC9S12DG128CPVE von NXP Semiconductors und MC9S12UF32PB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12DG128CPVE MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE Nrnd
NXP Semiconductors
MC9S12UF32PB MC9S12UF32PB - HCS12 16-Bit MCU, 32KB Flash, 30MHz | NXP

MC9S12UF32PB - HCS12 16-Bit MCU, 32KB Flash, 30MHz | NXP

MC9S12UF32PB ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12DG128CPVE MC9S12UF32PB
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $4,35
Product Type 16-bit HCS12 microcontroller —
Core Frequency 25 MHz —
Program Memory 128 KB flash —
RAM 8 KB —
EEPROM 2 KB —
Architecture HCS12, CISC —
Versorgungsspannung 2.35 V to 5.25 V [DATA_NEEDED: supply voltage range]
ADC Two 8-channel, 10-bit ADCs; 16 channels total —
Serial Communications Two asynchronous serial communications interfaces —
Timer 8-channel IC/OC enhanced capture timer —
PWM 8-channel pulse-width modulator —
Digital I/O 20 discrete digital I/O lines —
Betriebstemperatur -40°C to +85°C [DATA_NEEDED: operating temperature range]
Gehäuse 112-LQFP, 20 mm x 20 mm —
Oscillator Internal oscillator —
Automotive Qualification AEC-Q100 listed in verified distributor result —
RoHS [DATA_NEEDED: RoHS status] —
REACH [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Manufacturer — NXP Semiconductors
Series — HCS12
Core Processor — HCS12 (S12 CPU, 16-bit)
Program Memory Size — 32 KB (32K x 8) FLASH
RAM Size — 3.5 KB (3.5K x 8)
Maximale Taktfrequenz — 30 MHz
Number of I/O — 41
Gehäuse / Bauform — 64-LQFP (10x10 mm)
Oscillator Type — Internal
Program Memory Type — FLASH
Connectivity — SCI, SPI (per HCS12 family)
Peripherals — PWM, Timers, ADC (per family)
Data Converters — A/D converter (per family)
Montageart — Surface Mount
Packaging — Tray
RoHS-Status — Compliant
Debug Interface — BDM (Background Debug Mode)

Datenblätter & Ressourcen

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