MC9S12DG128CPVE vs MC9S12UF32PB Comparação

Comparação detalhada lado a lado de MC9S12DG128CPVE por NXP Semiconductors e MC9S12UF32PB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12DG128CPVE MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE - 16-bit 25MHz 128KB MCU | NXP

MC9S12DG128CPVE Nrnd
NXP Semiconductors
MC9S12UF32PB MC9S12UF32PB - HCS12 16-Bit MCU, 32KB Flash, 30MHz | NXP

MC9S12UF32PB - HCS12 16-Bit MCU, 32KB Flash, 30MHz | NXP

MC9S12UF32PB ✓ Ativo

Comparação de especificações

Parâmetro MC9S12DG128CPVE MC9S12UF32PB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida NRND Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $4,35
Product Type 16-bit HCS12 microcontroller —
Core Frequency 25 MHz —
Program Memory 128 KB flash —
RAM 8 KB —
EEPROM 2 KB —
Architecture HCS12, CISC —
Tensão de alimentação 2.35 V to 5.25 V [DATA_NEEDED: supply voltage range]
ADC Two 8-channel, 10-bit ADCs; 16 channels total —
Serial Communications Two asynchronous serial communications interfaces —
Timer 8-channel IC/OC enhanced capture timer —
PWM 8-channel pulse-width modulator —
Digital I/O 20 discrete digital I/O lines —
Temperatura de operação -40°C to +85°C [DATA_NEEDED: operating temperature range]
Encapsulamento 112-LQFP, 20 mm x 20 mm —
Oscillator Internal oscillator —
Automotive Qualification AEC-Q100 listed in verified distributor result —
RoHS [DATA_NEEDED: RoHS status] —
REACH [DATA_NEEDED: REACH status] —
Lead-Free Status [DATA_NEEDED: lead-free status] —
Manufacturer — NXP Semiconductors
Series — HCS12
Core Processor — HCS12 (S12 CPU, 16-bit)
Program Memory Size — 32 KB (32K x 8) FLASH
RAM Size — 3.5 KB (3.5K x 8)
Frequência máxima de clock — 30 MHz
Number of I/O — 41
Encapsulamento / Caixa — 64-LQFP (10x10 mm)
Oscillator Type — Internal
Program Memory Type — FLASH
Connectivity — SCI, SPI (per HCS12 family)
Peripherals — PWM, Timers, ADC (per family)
Data Converters — A/D converter (per family)
Tipo de montagem — Surface Mount
Packaging — Tray
Status RoHS — Compliant
Debug Interface — BDM (Background Debug Mode)

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