MC9S12DG128CPVE vs MC9S12UF32PB Comparación
Comparación detallada lado a lado de MC9S12DG128CPVE por NXP Semiconductors y MC9S12UF32PB por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12DG128CPVE | MC9S12UF32PB |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $4,35 |
| Product Type | 16-bit HCS12 microcontroller | — |
| Core Frequency | 25 MHz | — |
| Program Memory | 128 KB flash | — |
| RAM | 8 KB | — |
| EEPROM | 2 KB | — |
| Architecture | HCS12, CISC | — |
| Tensión de alimentación | 2.35 V to 5.25 V | [DATA_NEEDED: supply voltage range] |
| ADC | Two 8-channel, 10-bit ADCs; 16 channels total | — |
| Serial Communications | Two asynchronous serial communications interfaces | — |
| Timer | 8-channel IC/OC enhanced capture timer | — |
| PWM | 8-channel pulse-width modulator | — |
| Digital I/O | 20 discrete digital I/O lines | — |
| Temperatura de funcionamiento | -40°C to +85°C | [DATA_NEEDED: operating temperature range] |
| Encapsulado | 112-LQFP, 20 mm x 20 mm | — |
| Oscillator | Internal oscillator | — |
| Automotive Qualification | AEC-Q100 listed in verified distributor result | — |
| RoHS | [DATA_NEEDED: RoHS status] | — |
| REACH | [DATA_NEEDED: REACH status] | — |
| Lead-Free Status | [DATA_NEEDED: lead-free status] | — |
| Manufacturer | — | NXP Semiconductors |
| Series | — | HCS12 |
| Core Processor | — | HCS12 (S12 CPU, 16-bit) |
| Program Memory Size | — | 32 KB (32K x 8) FLASH |
| RAM Size | — | 3.5 KB (3.5K x 8) |
| Frecuencia de reloj máxima | — | 30 MHz |
| Number of I/O | — | 41 |
| Encapsulado / Carcasa | — | 64-LQFP (10x10 mm) |
| Oscillator Type | — | Internal |
| Program Memory Type | — | FLASH |
| Connectivity | — | SCI, SPI (per HCS12 family) |
| Peripherals | — | PWM, Timers, ADC (per family) |
| Data Converters | — | A/D converter (per family) |
| Tipo de montaje | — | Surface Mount |
| Packaging | — | Tray |
| Estado RoHS | — | Compliant |
| Debug Interface | — | BDM (Background Debug Mode) |