MC9S12DG256BCPV vs MC9S12DG256MPVE Vergleich
Detaillierter Direktvergleich von MC9S12DG256BCPV von NXP Semiconductors und MC9S12DG256MPVE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S12DG256BCPV | MC9S12DG256MPVE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,40 | $75,08 |
| Core Processor | HCS12 | HCS12 |
| Core Size | 16-bit | — |
| Core Architecture | CISC | 16-bit CISC |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| Program Memory Type | Flash | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB x 8 | — |
| Number of I/O | 91 | — |
| Versorgungsspannung | 2.5 V / 5 V | [DATA_NEEDED: Supply Voltage] |
| Oscillator Type | Internal | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| Gehäuse / Bauform | 112-LQFP (20 x 20 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Maximale Taktfrequenz | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 8 |
| GPIO Count | — | 91 |
| Gehäuse | — | 112-LQFP (20 x 20 mm) |
| Number of I/O Banks / Ports | — | [DATA_NEEDED: Port Count] |
| Communication Interfaces | — | [DATA_NEEDED: Serial Interfaces (SCI/SPI/CAN)] |
| Lebenszyklusstatus | — | NRND (Not Recommended for New Designs) |