MC9S12DG256BCPV vs MC9S12DG256MPVE Comparación
Comparación detallada lado a lado de MC9S12DG256BCPV por NXP Semiconductors y MC9S12DG256MPVE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12DG256BCPV | MC9S12DG256MPVE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $22,40 | $75,08 |
| Core Processor | HCS12 | HCS12 |
| Core Size | 16-bit | — |
| Core Architecture | CISC | 16-bit CISC |
| Maximum Clock Speed | 25 MHz | — |
| Program Memory Size | 256 KB (256K x 8) Flash | — |
| Program Memory Type | Flash | — |
| RAM Size | 12 KB | — |
| EEPROM Size | 4 KB x 8 | — |
| Number of I/O | 91 | — |
| Tensión de alimentación | 2.5 V / 5 V | [DATA_NEEDED: Supply Voltage] |
| Oscillator Type | Internal | — |
| Connectivity | CANbus, I2C, SCI, SPI | — |
| Peripherals | PWM, WDT | — |
| Encapsulado / Carcasa | 112-LQFP (20 x 20 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: Operating Temperature Range] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS Status] |
| Frecuencia de reloj máxima | — | 25 MHz |
| Flash Memory | — | 256 KB (256K x 8) |
| RAM | — | 12 KB |
| EEPROM | — | 4 KB |
| ADC Resolution | — | 10-bit |
| ADC Channels | — | 8 |
| GPIO Count | — | 91 |
| Encapsulado | — | 112-LQFP (20 x 20 mm) |
| Number of I/O Banks / Ports | — | [DATA_NEEDED: Port Count] |
| Communication Interfaces | — | [DATA_NEEDED: Serial Interfaces (SCI/SPI/CAN)] |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |