MC9S12NE64VTUE vs MC9S12NE64VTU Vergleich
Detaillierter Direktvergleich von MC9S12NE64VTUE von NXP Semiconductors und MC9S12NE64VTU von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MC9S12NE64VTUE ObsoleteNXP Semiconductors
MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
MC9S12NE64VTU ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12NE64VTUE | MC9S12NE64VTU |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Core Processor | HCS12 | — |
| Core Size | 16-Bit | — |
| Core Clock Speed | 25 MHz | — |
| Program Memory (Flash) | 64 KB (64K x 8) | — |
| RAM | 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet] | 8 KB |
| Operating Voltage | 2.5 V / 3.3 V (dual-rail VDD/VDDX) | — |
| Supply Voltage Range | 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet] | — |
| Betriebstemperatur | -40C to +105C (Industrial 'V' / 'TUE' suffix) | -40C to +105C (industrial) |
| Montageart | Surface Mount (TQFP-EP) | Surface Mount |
| Gehäuse / Bauform | 80-TQFP-EP (14x14 mm) with exposed thermal pad | — |
| Anzahl der Pins | 80 | — |
| Integrated Ethernet | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) | — |
| CAN Controllers | 2 x msCAN 2.0A/B | — |
| Serial Interfaces | 3 x SCI (UART), 1 x SPI, 1 x IIC | SCI (UART), SPI, I2C |
| ADC | 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels] | 10-bit, 8-channel |
| PWM Channels | 8 [DATA_NEEDED: confirm channel count from datasheet] | — |
| Timers | 16-bit, 4-channel Enhanced Capture Timer | ECT, PWM, TIM (8/16-bit) |
| Debug Interface | Background Debug Mode (BDM) | — |
| Terminal Form | GULL WING | — |
| Package Code | TQFP | — |
| Tray Packaging | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) | — |
| MSL-Level | 3 [DATA_NEEDED: confirm MSL rating] | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Speed | — | 25 MHz (25 MIPS) |
| Program Memory | — | 64 KB Flash |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Operating Voltage (Core) | — | 2.5 V |
| Operating Voltage (I/O) | — | 3.3 V |
| Ethernet MAC | — | Integrated 10/100 EMAC with MII interface |
| Gehäuse | — | 80-TQFP-EP (14x14 mm) |