MC9S12NE64VTUE vs MC9S12NE64VTU Comparación
Comparación detallada lado a lado de MC9S12NE64VTUE por NXP Semiconductors y MC9S12NE64VTU por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MC9S12NE64VTUE ObsoleteNXP Semiconductors
MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
MC9S12NE64VTU ✓ ActivoComparación de especificaciones
| Parámetro | MC9S12NE64VTUE | MC9S12NE64VTU |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Core Processor | HCS12 | — |
| Core Size | 16-Bit | — |
| Core Clock Speed | 25 MHz | — |
| Program Memory (Flash) | 64 KB (64K x 8) | — |
| RAM | 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet] | 8 KB |
| Operating Voltage | 2.5 V / 3.3 V (dual-rail VDD/VDDX) | — |
| Supply Voltage Range | 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet] | — |
| Temperatura de funcionamiento | -40C to +105C (Industrial 'V' / 'TUE' suffix) | -40C to +105C (industrial) |
| Tipo de montaje | Surface Mount (TQFP-EP) | Surface Mount |
| Encapsulado / Carcasa | 80-TQFP-EP (14x14 mm) with exposed thermal pad | — |
| Número de pines | 80 | — |
| Integrated Ethernet | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) | — |
| CAN Controllers | 2 x msCAN 2.0A/B | — |
| Serial Interfaces | 3 x SCI (UART), 1 x SPI, 1 x IIC | SCI (UART), SPI, I2C |
| ADC | 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels] | 10-bit, 8-channel |
| PWM Channels | 8 [DATA_NEEDED: confirm channel count from datasheet] | — |
| Timers | 16-bit, 4-channel Enhanced Capture Timer | ECT, PWM, TIM (8/16-bit) |
| Debug Interface | Background Debug Mode (BDM) | — |
| Terminal Form | GULL WING | — |
| Package Code | TQFP | — |
| Tray Packaging | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) | — |
| Nivel MSL | 3 [DATA_NEEDED: confirm MSL rating] | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Speed | — | 25 MHz (25 MIPS) |
| Program Memory | — | 64 KB Flash |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Operating Voltage (Core) | — | 2.5 V |
| Operating Voltage (I/O) | — | 3.3 V |
| Ethernet MAC | — | Integrated 10/100 EMAC with MII interface |
| Encapsulado | — | 80-TQFP-EP (14x14 mm) |