MC9S12NE64VTUE vs MC9S12NE64VTU Comparaison
Comparaison détaillée côte à côte de MC9S12NE64VTUE par NXP Semiconductors et MC9S12NE64VTU par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12NE64VTUE - 16-bit HCS12 MCU, 64KB Flash, Ethernet | NXP
MC9S12NE64VTUE ObsoleteNXP Semiconductors
MC9S12NE64VTU - 16-bit HCS12 MCU 64KB Flash EMAC 80-TQFP-EP | NXP
MC9S12NE64VTU ✓ ActifComparaison des spécifications
| Paramètre | MC9S12NE64VTUE | MC9S12NE64VTU |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Obsolete | Actif |
| Core Processor | HCS12 | — |
| Core Size | 16-Bit | — |
| Core Clock Speed | 25 MHz | — |
| Program Memory (Flash) | 64 KB (64K x 8) | — |
| RAM | 8 KB [DATA_NEEDED: confirm exact SRAM size from datasheet] | 8 KB |
| Operating Voltage | 2.5 V / 3.3 V (dual-rail VDD/VDDX) | — |
| Supply Voltage Range | 2.0 V to 5.5 V [DATA_NEEDED: confirm per datasheet] | — |
| Température de fonctionnement | -40C to +105C (Industrial 'V' / 'TUE' suffix) | -40C to +105C (industrial) |
| Type de montage | Surface Mount (TQFP-EP) | Surface Mount |
| Boîtier / Format | 80-TQFP-EP (14x14 mm) with exposed thermal pad | — |
| Nombre de broches | 80 | — |
| Integrated Ethernet | 10/100 Mbps IEEE 802.3 MAC + PHY (on-chip EMAC) | — |
| CAN Controllers | 2 x msCAN 2.0A/B | — |
| Serial Interfaces | 3 x SCI (UART), 1 x SPI, 1 x IIC | SCI (UART), SPI, I2C |
| ADC | 8-channel, 10-bit [DATA_NEEDED: confirm resolution/channels] | 10-bit, 8-channel |
| PWM Channels | 8 [DATA_NEEDED: confirm channel count from datasheet] | — |
| Timers | 16-bit, 4-channel Enhanced Capture Timer | ECT, PWM, TIM (8/16-bit) |
| Debug Interface | Background Debug Mode (BDM) | — |
| Terminal Form | GULL WING | — |
| Package Code | TQFP | — |
| Tray Packaging | Yes (Tray, Bakeable, Multiple in Drypack, min 60 pcs) | — |
| Niveau MSL | 3 [DATA_NEEDED: confirm MSL rating] | — |
| Statut RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Core Architecture | — | HCS12 (16-bit CISC) |
| CPU Speed | — | 25 MHz (25 MIPS) |
| Program Memory | — | 64 KB Flash |
| EEPROM | — | [DATA_NEEDED: EEPROM size] |
| Operating Voltage (Core) | — | 2.5 V |
| Operating Voltage (I/O) | — | 3.3 V |
| Ethernet MAC | — | Integrated 10/100 EMAC with MII interface |
| Boîtier | — | 80-TQFP-EP (14x14 mm) |