MC9S12XDT512CAA vs MC9S12XDT256CAA Vergleich

Detaillierter Direktvergleich von MC9S12XDT512CAA von NXP Semiconductors und MC9S12XDT256CAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XDT512CAA MC9S12XDT512CAA - 16-Bit HCS12X MCU 512KB Flash | NXP

MC9S12XDT512CAA - 16-Bit HCS12X MCU 512KB Flash | NXP

MC9S12XDT512CAA ✓ Aktiv
NXP Semiconductors
MC9S12XDT256CAA MC9S12XDT256CAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256CAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256CAA Nrnd

Spezifikationsvergleich

Parameter MC9S12XDT512CAA MC9S12XDT256CAA
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $16,40 $10,83
Core Architecture HCS12X (16-bit CISC, enhanced HCS12) —
Maximum CPU Frequency 80 MHz (40 MHz bus) —
Program Flash 512 KB (512K x 8) —
RAM 20 KB —
EEPROM 4 KB —
Gehäuse 80-QFP (14x14 mm) —
Pin/Package Type 80-pin PQFP, Tray —
Versorgungsspannung 2.35 V to 5.5 V (2.5 V/5 V domains) —
GPIO Count 59 (up to 119 I/O ports depending on mode) —
ADC 8-channel, 10-bit —
Timers ECT (Enhanced Capture Timer), 16 channels; PIT (Periodic Interrupt Timer) —
Communication Interfaces CAN (msCAN), SCI, SPI, I2C —
Betriebstemperatur -40C to +85C (industrial/automotive) -40C to +85C (TA)
Montageart Surface Mount Surface Mount
MSL-Level 3 (168 hours) —
RoHS-Status Compliant —
AEC-Q100 Qualified (automotive grade) —
On-chip Voltage Regulator Yes (internal VREG for single 5 V supply) —
Core Processor — HCS12X (S12XD)
Core Size — 16-Bit
Speed — 80 MHz
Flash Memory — 256KB (256K x 8)
Number of I/O — 59
Supply Voltage (Vdd) — 2.35 V to 5.5 V (per distributor listing)
Data Converters — A/D 10-bit
Gehäuse / Bauform — 80-QFP (14x14 mm)
Supplier Device Package — 80-QFP (14x14)
Terminal Form — Gull Wing
Package Shape — Square (QFP)
Packaging Method — Tray
Series — HCS12X / S12XD Family (MC9S12XDT256)
Temperature Grade — Industrial
Lifecycle Status (NXP) — NRND (Not Recommended for New Designs)
EEPROM Size — [DATA_NEEDED: EEPROM Size]
SRAM Size — [DATA_NEEDED: SRAM Size]
Peripherals (CAN/LIN/SPI/SCI) — [DATA_NEEDED: peripheral counts]

Datenblätter & Ressourcen

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