MC9S12XDT512CAA vs MC9S12XDT256CAA Comparación
Comparación detallada lado a lado de MC9S12XDT512CAA por NXP Semiconductors y MC9S12XDT256CAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S12XDT512CAA | MC9S12XDT256CAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,40 | $10,83 |
| Core Architecture | HCS12X (16-bit CISC, enhanced HCS12) | — |
| Maximum CPU Frequency | 80 MHz (40 MHz bus) | — |
| Program Flash | 512 KB (512K x 8) | — |
| RAM | 20 KB | — |
| EEPROM | 4 KB | — |
| Encapsulado | 80-QFP (14x14 mm) | — |
| Pin/Package Type | 80-pin PQFP, Tray | — |
| Tensión de alimentación | 2.35 V to 5.5 V (2.5 V/5 V domains) | — |
| GPIO Count | 59 (up to 119 I/O ports depending on mode) | — |
| ADC | 8-channel, 10-bit | — |
| Timers | ECT (Enhanced Capture Timer), 16 channels; PIT (Periodic Interrupt Timer) | — |
| Communication Interfaces | CAN (msCAN), SCI, SPI, I2C | — |
| Temperatura de funcionamiento | -40C to +85C (industrial/automotive) | -40C to +85C (TA) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (168 hours) | — |
| Estado RoHS | Compliant | — |
| AEC-Q100 | Qualified (automotive grade) | — |
| On-chip Voltage Regulator | Yes (internal VREG for single 5 V supply) | — |
| Core Processor | — | HCS12X (S12XD) |
| Core Size | — | 16-Bit |
| Speed | — | 80 MHz |
| Flash Memory | — | 256KB (256K x 8) |
| Number of I/O | — | 59 |
| Supply Voltage (Vdd) | — | 2.35 V to 5.5 V (per distributor listing) |
| Data Converters | — | A/D 10-bit |
| Encapsulado / Carcasa | — | 80-QFP (14x14 mm) |
| Supplier Device Package | — | 80-QFP (14x14) |
| Terminal Form | — | Gull Wing |
| Package Shape | — | Square (QFP) |
| Packaging Method | — | Tray |
| Series | — | HCS12X / S12XD Family (MC9S12XDT256) |
| Temperature Grade | — | Industrial |
| Lifecycle Status (NXP) | — | NRND (Not Recommended for New Designs) |
| EEPROM Size | — | [DATA_NEEDED: EEPROM Size] |
| SRAM Size | — | [DATA_NEEDED: SRAM Size] |
| Peripherals (CAN/LIN/SPI/SCI) | — | [DATA_NEEDED: peripheral counts] |