MC9S12XDT512CAA vs MC9S12XDT256CAA Comparação

Comparação detalhada lado a lado de MC9S12XDT512CAA por NXP Semiconductors e MC9S12XDT256CAA por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12XDT512CAA MC9S12XDT512CAA - 16-Bit HCS12X MCU 512KB Flash | NXP

MC9S12XDT512CAA - 16-Bit HCS12X MCU 512KB Flash | NXP

MC9S12XDT512CAA ✓ Ativo
NXP Semiconductors
MC9S12XDT256CAA MC9S12XDT256CAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256CAA - 16-bit 80MHz 256KB Flash MCU | NXP

MC9S12XDT256CAA Nrnd

Comparação de especificações

Parâmetro MC9S12XDT512CAA MC9S12XDT256CAA
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo NRND
Status do estoque In Stock In Stock
Preço unitário (USD) $16,40 $10,83
Core Architecture HCS12X (16-bit CISC, enhanced HCS12) —
Maximum CPU Frequency 80 MHz (40 MHz bus) —
Program Flash 512 KB (512K x 8) —
RAM 20 KB —
EEPROM 4 KB —
Encapsulamento 80-QFP (14x14 mm) —
Pin/Package Type 80-pin PQFP, Tray —
Tensão de alimentação 2.35 V to 5.5 V (2.5 V/5 V domains) —
GPIO Count 59 (up to 119 I/O ports depending on mode) —
ADC 8-channel, 10-bit —
Timers ECT (Enhanced Capture Timer), 16 channels; PIT (Periodic Interrupt Timer) —
Communication Interfaces CAN (msCAN), SCI, SPI, I2C —
Temperatura de operação -40C to +85C (industrial/automotive) -40C to +85C (TA)
Tipo de montagem Surface Mount Surface Mount
Nível MSL 3 (168 hours) —
Status RoHS Compliant —
AEC-Q100 Qualified (automotive grade) —
On-chip Voltage Regulator Yes (internal VREG for single 5 V supply) —
Core Processor — HCS12X (S12XD)
Core Size — 16-Bit
Speed — 80 MHz
Flash Memory — 256KB (256K x 8)
Number of I/O — 59
Supply Voltage (Vdd) — 2.35 V to 5.5 V (per distributor listing)
Data Converters — A/D 10-bit
Encapsulamento / Caixa — 80-QFP (14x14 mm)
Supplier Device Package — 80-QFP (14x14)
Terminal Form — Gull Wing
Package Shape — Square (QFP)
Packaging Method — Tray
Series — HCS12X / S12XD Family (MC9S12XDT256)
Temperature Grade — Industrial
Lifecycle Status (NXP) — NRND (Not Recommended for New Designs)
EEPROM Size — [DATA_NEEDED: EEPROM Size]
SRAM Size — [DATA_NEEDED: SRAM Size]
Peripherals (CAN/LIN/SPI/SCI) — [DATA_NEEDED: peripheral counts]

Fichas técnicas e recursos

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