MC9S12XDT512CAG vs MC9S12XET256CAG Vergleich

Detaillierter Direktvergleich von MC9S12XDT512CAG von NXP Semiconductors und MC9S12XET256CAG von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XDT512CAG MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDT512CAG - 16-bit 80MHz 512KB Flash MCU | NXP

MC9S12XDT512CAG Nrnd
NXP Semiconductors
MC9S12XET256CAG MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MC9S12XET256CAG - 16-bit 256KB Flash S12X MCU | NXP

MC9S12XET256CAG ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S12XDT512CAG MC9S12XET256CAG
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $85,00 $10,55
Core Processor HCS12X (CPU12X) —
Core Size 16-bit —
Speed 80 MHz —
Program Memory Type FLASH —
Program Memory Size 512 KB (512K x 8) —
Versorgungsspannung 2.35 V to 2.75 V 3.13 V to 5.5 V (single 5 V supply with on-chip regulator)
I/O Count 119 —
Gehäuse 144-LQFP (20x20 mm) 144-LQFP (20x20 mm)
Montageart Surface Mount Surface Mount
Architecture HCS12X (CISC, upward compatible with HCS12) —
Family Series 9S12X (S12XD) —
Technology CMOS —
Target Application Automotive multiplexing —
Life Cycle Stage ACTIVE (per datasheet listings); NRND per NXP product page —
Connectivity CAN, SCI, SPI, I2C [DATA_NEEDED: exact peripheral count] —
ADC Resolution [DATA_NEEDED: ADC resolution] —
RAM Size [DATA_NEEDED: RAM size] —
EEPROM Size [DATA_NEEDED: EEPROM size] —
Betriebstemperatur [DATA_NEEDED: operating temperature range] -40 C to +85 C (CAG grade, see datasheet)
Core — S12X (16-bit CISC) + XGATE co-processor
CPU Architecture — 16-bit HCS12X
Maximale Taktfrequenz — 50 MHz
Program Memory (Flash) — 256 KB (256K x 8)
RAM — 16 KB
EEPROM (emulated) — 4 KB
ADC — 16-channel, 12-bit
CAN Modules — 4 x CAN 2.0 A/B
GPIO — Up to 119
MSL-Level — 3 (per JEDEC J-STD-020)
RoHS-Status — Compliant
Debug Interface — BDM (Background Debug Mode)
Memory Protection Unit — Yes (supervisor/user modes)

Datenblätter & Ressourcen

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