MC9S12XDT512VPV vs MC9S12XDT512MAA Vergleich

Detaillierter Direktvergleich von MC9S12XDT512VPV von NXP Semiconductors und MC9S12XDT512MAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S12XDT512VPV MC9S12XDT512VPV - HCS12X 512KB Flash MCU | NXP Semiconductors

MC9S12XDT512VPV - HCS12X 512KB Flash MCU | NXP Semiconductors

MC9S12XDT512VPV ✓ Aktiv
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

Spezifikationsvergleich

Parameter MC9S12XDT512VPV MC9S12XDT512MAA
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $11,25 $0,00
Core Architecture HCS12X (CPU12X + XGATE co-processor) —
Flash Memory 512 KB —
RAM 32 KB —
EEPROM 4 KB —
Maximum CPU Frequency 40 MHz —
Operating Voltage 3.15 V to 5.5 V —
Gehäuse LQFP-112 (20x20 mm, gull-wing) 80-QFP (14x14 mm), Square, Gull Wing
Number of Terminals 112 —
Terminal Form GULL WING —
Package Shape SQUARE —
Temperature Grade INDUSTRIAL —
CAN Controllers 2 (MSCAN, CAN 2.0 A/B) —
ADC 10-bit, up to 24 channels —
PWM Channels 4 (with hardware fault input) —
XGATE Channels Up to 32 interrupt sources —
Moisture Sensitivity Level 3 (per JEDEC J-STD-020) —
Core Processor — HCS12X
Core Size — 16-Bit
Maximum Clock Speed — 80 MHz
Program Memory Size — 512KB (512K x 8)
Program Memory Type — FLASH
RAM Size — 20KB
EEPROM Size — 4KB
Connectivity — CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals — LVD, POR, PWM, WDT
Number of I/O — 59
ADC Resolution — 10-bit, 8-channel
Versorgungsspannung — [DATA_NEEDED: supply voltage range]
Betriebstemperatur — -40C to +125C (TA)
Montageart — Surface Mount
Packaging Method — Tray
Halogenfrei — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern